IT Industry Stagnation and Lower Abrasive Materials Demand

「Although demand for general-purpose silicon wafer applications remained weak, demand for advanced products remained firm and secured sales at a certain level. Hard disk demand for data centers recovered, while demand for LCD glass applications remained strong and orders increased due to China's consumer electronics subsidy policy.」

「In the semiconductor device application (CMP) for ultra-precision processing abrasives, orders remained steady because demand for semiconductors for leading-edge logic applications increased with the spread of generative AI. Demand for silicon wafer applications was weak for general-purpose products, but remained steady for advanced products, securing sales at a certain level. Demand for hard-disk applications recovered for data centers, while demand for panels in liquid-crystal glass applications remained strong due to China’s consumer electronics subsidy policy, resulting in increased orders.」

「Although demand for general-purpose silicon wafer applications remained weak, demand for advanced products remained firm and secured sales at a certain level. Hard disk demand for data centers recovered, while demand for LCD glass applications remained strong and orders increased due to China's subsidy policy for panels.」

「Orders for semiconductor device applications (CMP) increased on higher demand for semiconductors used in memory, including HBM, and leading-edge logic applications as generative AI spread, together with higher inventory levels at some users. Although demand for general-purpose silicon wafer applications remained weak, demand for advanced products remained firm and secured sales at a certain level. Hard disk demand for data centers recovered, while consumption of LCD panels accelerated from the second half as TV demand increased, resulting in a recovery in orders.」

「Orders for semiconductor device applications (CMP) increased on higher demand for semiconductors used in memory and leading-edge logic applications as generative AI rapidly spread, as well as higher inventory levels at some users accompanying increased production. Silicon wafer applications moved toward recovery as excess market inventories were gradually cleared. Hard disk demand for data centers also began to recover, while orders for LCD glass applications remained sluggish as weak panel market conditions persisted.」

「Among the company's core abrasives for ultraprecision processing, orders for semiconductor device applications (CMP) declined in the first half due to the semiconductor market's adjustment phase, but signs of a gradual recovery in demand emerged in the second half as major semiconductor manufacturers made progress in adjusting inventories. Orders for silicon wafer applications declined due to an overall decrease in demand for semiconductor devices. Demand for hard disk applications remained weak for data centers, while orders for LCD glass applications declined amid slower demand for LCD panels used in TVs, PCs and smartphones due in part to global inflation. Meanwhile, strong demand continued in areas including automotive applications, particularly electric vehicles (EVs), and power semiconductors used in vehicles and data centers.」

「Although signs of a bottoming-out emerged in some areas of the semiconductor market, demand for silicon wafer and semiconductor device applications (CMP) and other applications remained weak and orders declined sharply as high inventory levels persisted and inventory adjustments continued. Orders for hard disk applications declined due to weaker demand from PCs and data centers. Orders for LCD glass applications also declined as panel manufacturers sharply reduced production in response to weak demand for digital devices. Meanwhile, strong demand continued in areas including automotive applications, particularly electric vehicles (EVs), and power semiconductors used in vehicles and data centers.」

「Among the company's core abrasives for ultraprecision processing, demand for silicon wafer and semiconductor device applications (CMP) and other applications remained weak, and orders declined sharply as major semiconductor manufacturers prioritized inventory adjustments and reductions to respond to rapid changes in global markets amid a global slowdown in demand. In addition, orders for hard disk applications declined as customer operations fell sharply due to weaker demand from PCs and data centers. Orders for LCD glass applications also declined as customers reduced production and adjusted inventories in response to excess inventories at panel manufacturers.」

「Silicon wafer and semiconductor device applications (CMP) and other applications entered a global economic downturn due to the impact of global inflation and monetary policy. In the second half, the silicon cycle also peaked, affecting demand for semiconductors.」

「Among the company's core abrasives for ultraprecision processing, orders for hard disk and LCD glass applications declined sharply as major users made substantial production and inventory adjustments following the reactionary decline after the COVID-19 special demand. Silicon wafer and semiconductor device applications (CMP) and other applications also entered an adjustment phase as operations declined under the impact of a global economic slowdown and weaker semiconductor demand for data centers, PCs, tablets and smartphones.」

「Among the company's core abrasives for ultraprecision processing, orders for hard disk and LCD glass applications declined as some major users adjusted production and inventories in response to the reactionary decline following the peak in stay-at-home demand. Meanwhile, demand for silicon wafer and semiconductor device applications (CMP) and other applications expanded as strong semiconductor demand was further boosted by the global semiconductor shortage.」

「Hard disk applications showed signs of recovery, particularly for high-capacity HDDs used in data centers, while orders for LCD glass applications declined amid continued inventory adjustments by major users.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) and other applications expanded as the global semiconductor shortage intensified amid the wider adoption of 5G and increased stay-at-home demand resulting from COVID-19. Demand for semiconductors used in 5G communications, automobiles, various sensors, PCs, smartphones and data centers increased. Orders for hard disk applications from some users declined, while LCD glass applications remained firm, led by demand for large TV panels.」

「Silicon wafer and semiconductor device applications (CMP) and other applications expanded as semiconductor manufacturers operated at full capacity amid a global semiconductor shortage, driven by increased demand for semiconductors used in 5G communications, automobiles, various sensors, PCs and smartphones. Orders for hard disk applications from some users declined. For LCD glass applications, demand for large TV and PC panels remained firm due to stay-at-home consumption, while demand for small and medium-sized panels declined.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) and other applications expanded against a backdrop of tight global semiconductor supply and demand, driven by increased demand for semiconductors used in 5G communications, automobiles, various sensors, PCs and smartphones. Orders for hard disk applications from some users declined. For LCD glass applications, demand for large panels remained firm, while demand for small and medium-sized panels remained weak.」

「Silicon wafer and semiconductor device applications (CMP) and other applications expanded on increased semiconductor demand for various sensors, 5G communications and PCs, as well as a rapid recovery in automobile sales. Orders for hard disk applications from some users declined. For LCD glass applications, demand for large TV and PC panels remained firm due to stay-at-home consumption related to COVID-19, while demand for small and medium-sized panels remained weak.」

「Silicon wafer and semiconductor device applications (CMP) and other applications expanded on increased semiconductor demand for various sensors and 5G communications, as well as user inventory build-ups. Hard disk applications showed signs of recovery, while orders for LCD glass applications declined amid continued inventory adjustments by major users.」

「Among the company's core abrasives for ultraprecision processing, orders for hard disk and LCD glass applications declined as some major users adjusted production and inventories. Silicon wafer and semiconductor device applications (CMP) and other applications expanded on increased semiconductor demand for various sensors and 5G communications, as well as user inventory build-ups, despite concerns about delays in procuring components and restrictions on economic activity resulting from COVID-19.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) and other applications expanded on increased semiconductor demand for various sensors and 5G communications, as well as user inventory build-ups, despite concerns about delays in procuring components and restrictions on economic activity resulting from COVID-19. Hard disk applications remained firm, supported by resilient demand for data centers, while LCD glass applications also remained firm on demand for large panels.」

「Among the company's core abrasives for ultraprecision processing, semiconductor device applications (CMP) and other applications expanded despite concerns about the impact of U.S.-China trade friction, Japan-South Korea trade issues and other uncertain economic conditions, supported by demand for various sensors and communications applications. Hard disk applications for data centers recovered, while LCD glass applications also remained firm, particularly for large panels.」

「Among the company's core abrasives for ultraprecision processing, semiconductor device applications (CMP) and other applications remained firm despite concerns about the impact of U.S.-China trade friction, Japan-South Korea trade issues and other uncertain economic conditions, supported by demand for various sensors and communications applications. Demand for hard disk applications for data centers recovered, as did demand for LCD glass applications, particularly for large panels.」

「Among the company's core abrasives for ultraprecision processing, semiconductor device applications (CMP) and other applications remained firm, although the impact of U.S.-China trade friction was a concern. Hard disk applications declined due to temporary inventory adjustments by users, while LCD glass applications recovered.」

「Toward the end of the period, shipments of electronic components declined as China's consumer spending slowed. LCD glass applications also declined amid continued panel inventory adjustments.」

「Among the company's core abrasives for ultraprecision processing, semiconductor device applications (CMP) and other applications expanded on strong semiconductor demand, particularly for memory and communications applications. Hard disk applications also remained firm, supported by resilient demand for servers used in data centers. LCD glass applications declined amid continued panel inventory adjustments.」

「Among the company's core abrasives for ultraprecision processing, semiconductor device applications (CMP) and other applications expanded on strong semiconductor demand, particularly for memory and communications applications. Hard disk applications also remained firm, supported by resilient demand for servers used in data centers. LCD glass applications declined amid continued panel inventory adjustments.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) and other applications expanded on strong semiconductor demand, particularly for memory and communications applications. Hard disk applications also remained firm, supported by resilient demand for servers used in data centers. LCD glass applications declined amid continued panel inventory adjustments.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) expanded steadily on strong semiconductor demand, particularly for memory and communications applications. Hard disk applications also remained firm, supported by strong demand for servers used in data centers. However, LCD glass applications continued to be affected by panel inventory adjustments, while general industrial applications, which had increased sharply year on year during the demand period associated with users' model changes, declined on a reactionary basis.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) expanded steadily on strong semiconductor demand, particularly for memory and communications applications, while applications for new uses such as sapphire substrates also grew. Hard disk applications remained firm, supported by strong demand for servers used in data centers. However, LCD glass applications continued to be affected by panel inventory adjustments, while general industrial applications, which had increased sharply year on year during the demand period associated with users' model changes, declined on a reactionary basis.」

「Among the company's core abrasives for ultraprecision processing, silicon wafer and semiconductor device applications (CMP) expanded steadily on strong semiconductor demand, particularly for memory and communications applications. Hard disk applications also remained firm, supported by strong demand for servers used in data centers. However, LCD glass applications declined amid continued panel inventory adjustments, while general industrial applications, which had increased sharply year on year during the demand period associated with users' model changes, declined on a reactionary basis.」

「LCD glass applications continued to decline due to panel inventory adjustments, while general industrial applications fell sharply as the demand period associated with users' model changes ended.」

「Among the company's core abrasives for ultraprecision processing, LCD glass applications declined due to panel inventory adjustments, and hard disk applications remained at the previous year's level. Silicon wafer and semiconductor device applications (CMP), however, expanded as semiconductor demand recovered, particularly for communications applications.」

「Among the company's core abrasives for ultraprecision processing, LCD glass applications declined due to panel inventory adjustments, while hard disk and silicon wafer applications remained at the previous year's levels. Semiconductor device applications (CMP), however, expanded as semiconductor demand recovered, particularly for communications applications.」

「Among the company's core abrasives for ultraprecision processing, LCD glass applications declined due to panel inventory adjustments, while hard disk and silicon wafer applications remained at the previous year's levels. Semiconductor device applications (CMP), however, expanded as semiconductor demand recovered, particularly for communications applications.」

「Demand for abrasive products used for hard disks, LCD glass, silicon wafers and CMP, which account for a significant proportion of the abrasives business, is affected by conditions in the IT industry, the principal customer market. If the IT industry stagnates in major markets including Japan, North America, Asia and Europe, resulting in a decline in demand, this could adversely affect the company's financial position, operating results and cash flows.」