Development of High-Performance Heat Sink Materials
First written in FY2023. 2 of 3 entries say "Advanced", first in FY2024. Latest entry: FY2026.
50 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Development of high-thermal-conductivity, low-coefficient-of-thermal-expansion materials The Company aims to enter new market areas by promoting further improvements in the properties of high-thermal-conductivity materials and developing new materials, targeting markets that require further improvements in cooling performance, including heat sinks, for which demand is expanding against the backdrop of rising heat generation density at data centers in recent years, as well as laser cooling for fusion-related applications.」
The Company is expanding the scope of its high-performance heat sink material development to markets requiring higher cooling performance, including data centers and laser cooling for fusion-related applications. - FY2024AdvancedAnnual report
「We are focusing on the use and development of high-performance heat sink materials that absorb and dissipate heat more efficiently, including new materials such as SiC.」
In addition to conventional aluminum nitride and copper-tungsten, it explicitly identifies new materials such as SiC, making the development targets more specific. - FY2023First statedAnnual report
「We are focusing on developing high-performance heat sink materials that absorb and dissipate heat more efficiently.」
Against a backdrop of demand for cooling high-power lasers and other equipment, we are advancing the development of materials using aluminum nitride, copper-tungsten and other materials.