Development of New and Recycling Technologies for Advanced Semiconductors
First written in FY2025. 2 of 3 entries say "Advanced", first in 2026-05-13. Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026AdvancedAnnual report
「In prototype evaluations of small-diameter modules, we have confirmed that the desired adsorption performance can be achieved. We intend to accelerate prototype evaluations of modules with larger diameters than those currently under development, measuring 300 mm or more in diameter, with a view to early commercialisation.」
The company reported progress in performance verification and patent acquisition for the new module, as well as the acquisition of 2 patents and receipt of a 2025 paper award for quartz component reclamation technology. - 2026-05-13AdvancedEarnings presentation
「We devised a recycling method for quartz glass components coated with a highly corrosion-resistant protective film (ceramic thermal-sprayed coating) and obtained 2 patents for the method.」
The company obtained 2 patents for a recycling method for quartz glass components, and the research and development achievement also led to an external paper award. - FY2025First statedAnnual report
「Development of a new module for advanced semiconductor packaging; development of applications for porous self-supporting membranes; commercialisation of a reclamation process for thermally sprayed quartz glass components; and self-healing technology for microcracks」
The company has 4 development themes: new modules, applications for porous membranes through industry-academia collaboration, quartz component reclamation, and self-healing of microcracks.