Announced details
Semiconductors, automotive applications, communications infrastructure, and other fields. This project covers the manufacture and inspection of semiconductor ceramics products.
Enables fine defects to be identified without contact and at high speed (quantitative effects: Not disclosed)
A business relationship in which the company received an order from the counterparty for the system and complete set of inspection equipment. Capital and personnel relationships: Not disclosed.
A global company that supplies high-value-added products to a wide range of fields, including semiconductors, automotive applications, and communications infrastructure, drawing on its advanced materials and precision processing technologies. The company name, location, representative, capital, and year of establishment are not disclosed.
One domestic plant (location: Not disclosed)
¥200–300 million (estimated amount based on a confidentiality agreement)
This project has already been incorporated into the earnings forecast for the fiscal year ending February 2027. The specific impact on earnings is Not disclosed.
The company does not address Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | AI visual inspection and 3D profile measurement inspection system plus a complete set of inspection equipment |
| Counterparty | Major semiconductor ceramics manufacturer |
| Counterparty overview | A global company that supplies high-value-added products to a wide range of fields, including semiconductors, automotive applications, and communications infrastructure, drawing on its advanced materials and precision processing technologies. The company name, location, representative, capital, and year of establishment are not disclosed. |
| Relationship with the Company | A business relationship in which the company received an order from the counterparty for the system and complete set of inspection equipment. Capital and personnel relationships: Not disclosed. |
| Contract Value | ¥200–300 million (estimated amount based on a confidentiality agreement) |
| Launch date | Rollout has begun at multiple production lines at one domestic plant (start date: Not disclosed) |
| Applicable area | Semiconductors, automotive applications, communications infrastructure, and other fields. This project covers the manufacture and inspection of semiconductor ceramics products. |
| Location | One domestic plant (location: Not disclosed) |
| Location scale | 1 plant, multiple production lines |
| Quantitative Effects | Enables fine defects to be identified without contact and at high speed (quantitative effects: Not disclosed) |
| Impact on Business Performance | This project has already been incorporated into the earnings forecast for the fiscal year ending February 2027. The specific impact on earnings is Not disclosed. |
Items this document does not state (7)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The project aims to digitalize the customer's manufacturing processes and improve the precision of product inspections. The order was awarded after the company's AI algorithms, ability to provide an integrated proposal including inspection equipment, on-site implementation capabilities, and high-speed, high-accuracy inspection performance were evaluated.